Soldering system type VADU 200XL-W
The VADU 200XL-W soldering system is equipped with two separate process chambers and is designed for both paste and preform soldering.
The VADU 200 XL-W enables the soldering of wafers up to 12 inches. PINK also offers customized workpiece carriers for this purpose.
It enables precise regulation and control of all relevant process parameters, such as the temperature gradients during heating and cooling. Thanks to intelligent temperature management, the systems have very short cycle times and excellent temperature stability.
VADU 200XL-W vacuum soldering system
Data sheet
| System type | Batch system |
| Number of vacuum chambers | 2 chambers |
| Usable area (W x D) | 410 x 320 mm |
| Sluice height | max. 100 mm |
| Vacuum (standard) | ≤ 2 mbar |
| System dimensions (W x D x H) | 1,200 x 1,890 x 1,680 mm |
| Dimensions of the pumping station | Integrated |
| Weight | 1.200 kg |
| Electrical connection | 3 x 400 V, 50/60 Hz |
| Connected load | 10 kVA |
| SMEMA interface | - |
Options
| Handling / transfer systems | |
| Integrated MES interfaces (e.g. SECS/GEM) |
System properties
- Blowhole-free soldered joints
- Soldering with preforms and / or pastes
- Individual soldering profiles
- Process temperatures up to 400 °C
- Controlled temperature gradients
- Short cycle times
- Wafers up to 12"
- Separate soldering and cooling chamber
- Formic acid process for flux-free soldering
- Condensate separation
- Inert protective gas atmosphere
- Residual oxygen content < 5 ppm
- Reproducibility of the soldering results
- Traceability (traceability)
- Continuous process control
- Ethernet interface
- Remote maintenance (VPN)
- Low energy and media consumption
Further vacuum soldering systems
VADU 100
Batch system
1 vacuum chamber
Through-feed height max. 50 mm
Size: 1,070 x 1,130 x 1,150 mm
VADU 100-I
Batch system
1 vacuum chamber
Throughfeed height max. 50 mm
Size: 1,330 x 1,180 x 1,200 mm
VADU modular
VADU core
Inline system
3 – 4 vacuum chambers
Max. through-feed height 100 mm
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