The database is currently being updated with all corrections.
Plasma activation can be used to increase the surface tension of polymer materials. Activation enables subsequent processes such as painting, bonding, printing and potting – without thermal stress on the material (cold plasma) and without aggressive primers.
Plasma cleaning leaves surfaces completely free of organic contaminants. As this is a dry chemical process at room temperature, the cleaned parts can be processed immediately.
Plasma etching (dry etching) is used for the removal (“descum”, “desmear”, “back etch” etc.) of production auxiliaries such as photoresist and sacrificial layers. Thanks to the pronounced mobility of the plasma, even the finest structures can be reached.
In plasma enhanced chemical vapour deposition (PECVD), materials or workpieces are given thin functional layers by polymerizing and depositing suitable precursor compounds in the plasma state.
Contact us and let us work together to develop solutions that meet your requirements. We look forward to hearing from you and helping you further.