Workpiece carrier
Surface treatment with low-pressure plasma
Activate in plasma
Plasma activation can be used to increase the surface tension of polymer materials. Activation enables subsequent processes such as painting, bonding, printing and potting – without thermal stress on the material (cold plasma) and without aggressive primers.
Cleaning in plasma
Plasma cleaning leaves surfaces completely free of organic contaminants. As this is a dry chemical process at room temperature, the cleaned parts can be processed immediately.
Etching in plasma
Plasma etching (dry etching) is used for the removal (“descum”, “desmear”, “back etch” etc.) of production auxiliaries such as photoresist and sacrificial layers. Thanks to the pronounced mobility of the plasma, even the finest structures can be reached.
Plasma coating
In plasma enhanced chemical vapour deposition (PECVD), materials or workpieces are given thin functional layers by polymerizing and depositing suitable precursor compounds in the plasma state.
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