Vacuum-assisted,
compact
sintering system
SIN 20
For small series production in R&D or laboratory applications
Compact and vacuum-assisted
The compact SIN 20 laboratory sintering system was designed for the quick and easy development and optimization of sintering processes.
The patented soft tool enables a wide variety of layouts to be processed with just one upper tool. Changes to the design of the components and the production of different customer samples can thus be realized without complex tool adaptations. The soft tool also allows several layers to be sintered in a single process step.
Flexible upper tool (high-force soft tool or hard tool)
Target applications:
- Sintering of semiconductors on ceramic substrates and on lead frames
- Sintering of substrates on base plates
- Sintering of chip topside contacting
- Sintering of high-power LEDs
SIN 20
System properties
- Hermetically sealed process chamber
- Sintering process area: max. 100 x 100 mm
- Max. Product height: 50 mm
- Min. Product distance: 0 mm
- Heating plate temperature: up to 350 °C
- Separate heating and cooling zones
- Dynamically adjustable pressing force from 1 to 200 kN
- Max. Pressing force in continuous operation: 175 kN
- Dynamically adjustable pressure: Softtool up to 30 MPa and Hardtool up to 60 MPa
- Dynamically controlled and monitored pressure ramps
- Travel speed: upwards up to 17.5 mm/s, downwards up to 27.5 mm/s
- Precise control of the process gases (N2, N2/O2, N2/H2, HCOOH)
- Gas pressure: 1 - 960 mbar
- Freely programmable, controllable and monitorable process parameters (temperature profiles, process gases and sintering pressure)
- Ethernet interface
- Remote access (VPN)
- Low energy and media consumption
Further sintering plants
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