The V10-G batch system was designed for the removal of photoresists and is also very well suited for wafer cleaning.
V10-G low-pressure plasma system
Applications
- Excellent for removing photoresist layers (including SU-8) after dry processes such as RIE or electron beam etching and after high-dose implantation
- Silicon wafers or other substrates can be treated to improve wettability before wet processes
- Can be used for processes in MEMS and nanotechnology
- Removal of polymer residues after the Bosch process
- Removal of organic sacrificial layers
- Conditioning of bioactive layer structures
Data sheet
| System type | Desktop unit |
| Chamber dimensions (Ø x D) | 215 x 260 mm |
| Microwave power | 50-600 W |
| Gas inlets with mass flow control | 1 channel |
| Electrical connection | 230 V, 50/60 Hz |
| Connected load (without pump) | 1.5 kVA |
| Pressure measurement | Pirani |
| System dimensions (W x D x H) | 720 x 820 x 820 mm |
Options
| Vacuum pump | |
| Ozone trap | |
| Soldering temperatures up to 500 °C | up to 2 |
| Soft start / soft ventilation | |
| Faraday cage | |
| Process pressure control valve |
System properties
- Process chamber: quartz glass
- Door pull-out
- System control: PLC (S7-300)
- Resistive touch panel with Windows operating system (can also be operated with gloves)
- Remote maintenance (VPN)
- Ethernet interface
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information?
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