The database is currently being updated with all corrections.
The database is currently being updated with all corrections.
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Power electronics is evolving rapidly. New material systems, smaller components, and higher reliability requirements—and, as a result, new demands on manufacturing equipment. With the SIN 50+ and the SIN 100 Multi Drive, PINK is introducing two sintering systems designed specifically to meet these changing needs.
Pressure-assisted sintering has established itself as the superior joining process for die-attach connections in power electronics. Higher thermal and electrical conductivity, as well as improved reliability in temperature and load cycling tests—the advantages over conventional solder joints have been proven.
For a long time, traditional silver sintering pastes—which require process pressures of up to 30 MPa—dominated the market. The systems designed for this purpose—such as the proven PINK SIN 200+ modular—are engineered to handle these high forces.
But the market has evolved. Modern copper-based sintering pastes and pressure-optimized silver systems can already be processed at 10 to 20 MPa. And diffusion brazing based on TLPS materials requires even less: 0.4 to 5 MPa is sufficient here. Anyone who buys a 30 MPa system for these processes is paying for force they’ll never need—and for weight, space, and investment costs that aren’t appropriate for the task.
Both systems are specifically designed for the pressure range of 0.4 to 20 MPa—making them tailor-made solutions for modern low-pressure processes. The SIN 50+ delivers up to 500 kN, while the SIN 100 Multi Drive delivers up to 1,000 kN.
What sets it apart from simpler, compact solutions: PINK has fully incorporated the SIN 200+ modular control architecture. Active force control, force-displacement monitoring, freely programmable temperature profiles—and seamless process control with recording of all relevant parameters. For purchasing decision-makers, this means: no compromises on quality and traceability, even in smaller systems.
In addition, it features a process area of 350 × 300 mm—a size that is currently unmatched on the market in this power class.
One die for all components—that rarely works in practice. SIN 50+ and SIN 100 Multi Drive use a soft tool concept based on an elastic solid material. This distributes the pressure evenly across the entire process surface—regardless of thickness tolerances or varying component heights.
Based on this, there are two tooling options to choose from: a hard-stamp tool with automatic alignment for tight tolerance requirements, and a multi-stamp tool for the simultaneous machining of components of varying heights on a substrate. Both can be swapped out by the operator—a product changeover does not require a service call.
Crucial for operation: The system generates force without the use of compressed gas or oil. This means there are no sealing elements subjected to continuous stress at high process temperatures—resulting in longer maintenance intervals and lower tooling costs.
More compact, lighter, and more cost-effective to purchase and operate—without compromising process quality. The sintering module of both systems measures 1,360 × 1,994 mm. Its lower weight compared to the SIN 200+ modular system simplifies integration even at sites with limited ceiling load capacity and reduces installation costs.
Both systems can be operated as stand-alone modules or expanded—even retroactively—to form a complete inline line by adding preheating and cooling modules.
Schedule a one-on-one consultation with our experts—and find out which system is right for your process and your needs.
