The modular SIN 50+ sintering system is a highly flexible platform that meets production requirements from laboratory operation to series production. Thanks to its modular design, it can be configured either as a batch system or as an automated inline system, consisting of optional preheating and cooling modules.

The system was developed as a cost-effective solution for processing modern low-pressure sintering materials and diffusion soldering materials. In addition to standard die sintering with the Softtool, it supports advanced applications such as multilayer sintering with the Softtool, die or clip sintering with hard stamps and diffusion soldering of power modules.

In the vacuum chambers, substrate temperature, gas pressure and gas composition can be precisely controlled during the entire heating, sintering and cooling process. Copper oxidation can be effectively minimized. In particular, the use of formic acid or forming gas enables the in-situ deoxidation of copper surfaces before and after sintering.
Creating or maintaining oxide-free surfaces is crucial, as clean and reactive interfaces improve the sinterability of silver and copper materials and ensure a high-quality surface finish.

The combination of dynamically adjustable pressing force and flexible tool design offers the versatility required to realize a wide variety of sintering and joining processes for different package designs.