The SIN 50+ modular sintering system is a highly flexible platform designed to meet production requirements from laboratory use to series production. Thanks to its modular design, it can be configured either as a batch system or as an automated inline system consisting of optional preheating and cooling modules.

The system was developed as a cost-effective solution for processing modern low-pressure sintering materials. In addition to standard die-sintering with the soft tool, it supports advanced applications such as multilayer sintering with the soft tool, die or clip sintering with hard stamps and diffusion soldering of power modules.

Within the vacuum chambers, the substrate temperature, atmospheric pressure and gas composition can be precisely controlled throughout the heating, sintering and cooling process. The oxidation of copper is effectively minimized. In particular, the use of formic acid or forming gas enables in-situ deoxidation of the copper surfaces before and after sintering. Maintaining or creating oxide-free surfaces is critical, as clean and reactive interfaces improve the sinterability of silver and copper materials and ensure a high-quality finish.
The combination of dynamically adjustable press force and flexible tooling provides the versatility required to realize a wide range of sintering and joining processes for different case designs.