The modular sintering system SIN 50+ is a highly flexible platform that meets production requirements from laboratory operation
to series production. Thanks to its modular design, it can be configured either as a batch system or
as an automated inline system, consisting of optional preheating and cooling modules.

The system was developed as a cost-effective solution for processing modern low-pressure sintering materials and
diffusion soldering materials. In addition to standard die sintering with the Softtool, it supports
advanced applications such as multilayer sintering with the Softtool, die or clip sintering with hard stamps
and diffusion soldering of power modules.

In the vacuum chambers, the substrate temperature, gas pressure and gas composition can be precisely controlled during the entire
heating, sintering and cooling process. Copper oxidation can be effectively minimized. In particular,
the use of formic acid or forming gas enables the in-situ deoxidation of copper surfaces
before and after sintering.

Creating or maintaining oxide-free surfaces is crucial, as clean and reactive interfaces improve the
sinterability of silver and copper materials and ensure a high-quality surface finish.
The combination of dynamically adjustable press force and flexible tool design offers the necessary
versatility to realize a wide variety of sintering and joining processes for different package designs.