The SIN 100 Multi Drive is a flexible platform for different package and heat sink layouts. It sinter
up to four heat sinks simultaneously. The system is designed for the series production of technically demanding components.
It reliably handles heat- and pressure-sensitive potting compounds and compensates for deformations
(warping and bow) of the heat sinks – by precisely controlling the force and temperature at each individual sintered joint.
The flexible tool interface enables fast tool changes. In addition to the sintering
of packages on heat sinks, the wide range of tools also supports applications such as die attach, clip attach
or diffusion soldering.

In the vacuum chamber, the substrate and package temperature, atmospheric pressure and gas composition
are precisely controlled throughout the entire heating, sintering and cooling process. A residual oxygen content of <10 ppm
prevents the oxidation of copper surfaces and particles. Formic acid or forming gas additionally enable
in-situ deoxidation. Oxide-free, reactive interfaces are crucial: they improve the sinterability
of silver and copper materials and ensure a high surface quality.

The SIN 100 Multi Drive combines modular flexibility with precise process control – for reliable sintering
of complex packages with high yield and high throughput.