Vacuum soldering system VADU 100-I

For highest precision in temperature control

The compact soldering system VADU 100-I operates primarily with preforms and generates void-free solder connections. It is equipped with separate process zones for soldering and cooling. The soldering area is divided in two controllable inductive heating zones.

Due to its small dimensions and the easy operation, the batch system is very suitable for production of small series and in laboratories for research applications.

Vacuum Soldering System VADU 100-I

With its vacuum-supported soldering process and the newly designed induction heating the system VADU 100-I

stands for high-quality void-free soldering results, even in small series production

Data sheet

Type of system	Batch system
Number of vacuum chambers	1 chamber with 2 separate process zones
Process area (W x D)	168 x 280 mm (e.g. 2 Cards à 4 x 6")
Clearance height	max. 50 mm
Vacuum (standard)	≤ 2 mbar
Dimensions of the system (W x D x H)	1,330 x 1,380 x 1,200 mm
Dimensions of pumping unit	Integrated
Weight	600 kg
Power supply	3 x 400 V, 50/60 Hz
Power input	5 kVA
SMEMA interface	–

Options

Traceability
Handling / transfer systems
Integrated MES interfaces (e.g. SECS/GEM)
Cooling system
Selective pin-cooling for the prevention of voids during cooling

Conventional vs. Induction Soldering

System features

Void-free solder connections
Two separate controllable inductive heating zones
Individual soldering profiles
Heat generation directly in the product
Soldering temperatures up to 500 °C
Controlled temperature gradients
Separate soldering and cooling zone
Inert gas atmosphere
Residual oxygen content < 5 ppm
Flux-free soldering with formic acid
Soldering with preforms and / or pastes
Short cycle times
Flux management
Reproducibility of the soldering results
Permanent process control
Ethernet interface
Remote maintenance (VPN)

Compare systems

Type	VADU 100	VADU 200XL	VADU 300XL	VADU 400XL
Type of system	Batch system	Batch or Inline system	Inline system	Inline system
Number of vacuum chambers	1 chamber with 2 separate process zones	2 chambers	3 chambers	4 chambers
Process area (W x D) [mm]	168 x 280	410 x 280	410 x 280	410 x 280
Clearance height [mm]	max. 50	max. 100	max. 100	max. 100
Vacuum (standard) [mbar]	≤ 2	≤ 2	≤ 2	≤ 2
Dimensions of the system (W x D x H) [mm]	1,070 x 1,130 x 1,150	1,758 x 1,911 x 2,381	2,436 x 1,911 x 2,381	3,114 x 1,911 x 2,381
Dimensions of pumping unit [mm]	Integrated	1,027 x 762 x 1,376	1,027 x 762 x 1,996	1,027 x 1,452 x 1,376
Weight [kg]	500	1,500 (without pumping unit)	2,000 (without pumping unit)	2,600 (without pumping unit)
Power supply	3 x 400 V, 50/60 Hz	3 x 400 V, 50/60 Hz	3 x 400 V, 50/60 Hz	3 x 400 V, 50/60 Hz
Power input [kVA]	5	19	27	35
SMEMA interface	–
Options
Handling / transfer systems
Soldering temperatures up to 500 °C
Induction heating		-	-	-
Integrated MES interfaces (e.g. SECS/GEM)