Soldering system VADU 100
For R&D and small series production
Compact and reliable
The compact soldering system VADU 100 is equipped with separate zones for soldering and cooling and can be operated with paste as well as preforms.
Due to its small dimensions and the easy operation, the batch system is very suitable for production of small series and in laboratories for research applications.
Soldering system VADU 100
Data sheet
Type of system | Batch system |
Number of vacuum chambers | 1 chamber with 2 separate process zones |
Process area (W x D) | 168 x 280 mm (e.g. 2 Cards à 4 x 6") |
Clearance height | max. 50 mm |
Vacuum (standard) | ≤ 2 mbar |
Dimensions of the system (W x D x H) |
1,070 x 1,130 x 1,150 mm |
Dimensions of pumping unit | Integrated |
Weight | 500 kg |
Power supply | 3 x 400 V, 50/60 Hz |
Power input | 5 kVA |
SMEMA interface | – |
Options
Handling / transfer systems | |
Soldering temperatures up to 500 °C | |
Induction heating | |
Integrated MES interfaces (e.g. SECS/GEM) |
System features
- Void-free solder connections
- Soldering with preforms and / or pastes
- Individual soldering profiles
- Process temperatures up to 400 °C
- Controlled temperature gradients
- Short cycle times
- Separate soldering and cooling zones
- Flux-free soldering with formic acid
- Flux management
- Inert gas atmosphere
- Residual oxygen content < 5 ppm
- Reproducibility of the soldering results
- Traceability
- Permanent process control
- Ethernet interface
- Remote maintenance (VPN)
- Low energy and media consumption
Compare systems
Type |
VADU 100 | VADU 200XL | VADU 300XL | VADU 400XL |
Type of system | Batch system | Batch or Inline system | Inline system | Inline system |
Number of vacuum chambers | 1 chamber with 2 separate process zones |
2 chambers | 3 chambers | 4 chambers |
Process area (W x D) [mm] |
168 x 280 | 410 x 280 | 410 x 280 | 410 x 280 |
Clearance height [mm] |
max. 50 | max. 100 | max. 100 | max. 100 |
Vacuum (standard) [mbar] |
≤ 2 | ≤ 2 | ≤ 2 | ≤ 2 |
Dimensions of the system (W x D x H) [mm] |
1,070 x 1,130 x 1,150 | 1,758 x 1,911 x 2,381 | 2,436 x 1,911 x 2,381 | 3,114 x 1,911 x 2,381 |
Dimensions of pumping unit [mm] |
Integrated | 1,027 x 762 x 1,376 | 1,027 x 762 x 1,996 | 1,027 x 1,452 x 1,376 |
Weight [kg] |
500 | 1,500 (without pumping unit) |
2,000 (without pumping unit) |
2,600 (without pumping unit) |
Power supply | 3 x 400 V, 50/60 Hz | 3 x 400 V, 50/60 Hz | 3 x 400 V, 50/60 Hz | 3 x 400 V, 50/60 Hz |
Power input [kVA] |
5 | 19 | 27 | 35 |
SMEMA interface | – | |||
Options |
||||
Handling / transfer systems |
||||
Soldering temperatures up to 500 °C | ||||
Induction heating | - | - | - | |
Integrated MES interfaces (e.g. SECS/GEM) |