Low-pressure plasma system V10-G

Efficient batch system for removal of photoresist

The batch system V10-G is designed for the removal of photoresists. Furthermore, it can be optimally used for the cleaning of wafers.

Ideal system for removing photoresist layers (also SU-8) after drying processes like RIE or Ion Beam etching as well as after high dose implant processes
Silicon wafers or other substrate cleaning prior wet processing to achieve a better wettability for an uniform and efficient result
Applicable for processes in MEMS and nano technology
Polymer removal e.g. after Bosch processes
Removal of organic sacrificial layers
Conditioning of bioactive compounds

Type of system	Tabletop unit
Dimensions of the chamber (Ø x D)	215 x 260 mm
Microwave power	50-600 W
Gas inlets with mass flow controller	1 channel
Power supply	230 V, 50/60 Hz
Power input (without pump)	1.5 kVA
Vacuum gauge	Pirani
Dimensions of the system (W x D x H)	720 x 820 x 820 mm

Vacuum pump
Ozone trap
Additional gas inlets	up to 2
Soft start and slow vent
Faraday cage
Process pressure control valve

Type	V6-G	V10-G	V15-G	V55-G	V80-G-Side
Type of system	Tabletop unit	Tabletop unit	19" cabinet	19" cabinet	19" cabinet
Dimensions of the chamber (W x D x H) [mm]	170 x 200 x 170	Ø215 x 260	250 x 250 x 250	400 x 460 x 340	400 x 500 x 430
Microwave power [W]	50-300	50-600	100-600	100-1,200	100-1,200
Gas inlets with mass flow control	1	1	1	2	2
Power supply	230 V, 50/60 Hz	230 V, 50/60 Hz	230 V, 50/60 Hz	230 V, 50/60 Hz	230 V, 50/60 Hz
Power input (without pump) [kVA]	0.5	1.5	1.5	2.2	2.2
Dimensions of the system (W x D x H) [mm]	640 x 710 x 710	720 x 820 x 820	670 x 900 x 1,850	670 x 900 x 1,850	850 x 900 x 1,850
Options
Additional gas inlets	2	2	3	2	2
Additional excitation frequencies (40 kHz, 13.56 MHz)	-	-
Soft start/slow vent
Lateral microwave feed-in		-		-
Rotary table	-	-
Rotary drum		-
Pullout door	-		-
Automatic door opening	-	-	-