Advantages of the VADUs

Plants and systems for void-free soldering with vacuum

Short cycle times and high performance by intelligent temperature management

The VADU systems have a short heating and cooling time with controlled gradients and a process temperature of up to 400 °C. In addition, temperature stability is secured during evacuation.

The substrate temperature is continuously monitored and controlled with an intelligent temperature regulation contacting the docking heating and cooling plate. This technology provides optimum soldering processes with short cycle times, fast soldering results and high performance.

Environment-friendly and easy to operate due to a smart design

Based on the compact design, the VADU soldering systems require a minimum of space and energy and are both economically and ecologically efficient during a 24/7 operation.

The ergonomic design of the VADU also provides advantages with regard to operation, service and maintenance due to an easy and quick access to the chambers.

Flexible soldering technologies for individual customer demands

PINK offers soldering systems suitable for each production strategy: VADU100 for laboratory or batch production, VADU200 for batch operation or VADU300 and VADU400 as automated inline systems for series production.

Each vacuum soldering system for preform and/or paste soldering under an inert soldering atmosphere can be equipped according to individual customer requirements with different customized options like e.g. formic acid equipment, transfer systems, handling equipment, etc.

Perfect and reproducible soldering results due to a continuous process control

All systems of the VADU series provide an individual definition as well as control and monitoring of the soldering profiles due to permanent product tracking and process control.

All process data can be tracked at any time due to a permanent parameterization during the soldering process. Therefore, reproducibility of the soldering processes is guaranteed and a constant high product quality is assured.

View into the process chambers of VADU soldering systems

System features

Void-free solder connections
Soldering with preforms and/or pastes
Individual soldering profiles
Process temperatures up to 400 °C
Controlled temperature gradients
Short cycle times
Separate soldering and cooling chamber or zones
Flux-free soldering with formic acid
Flux management
Inert gas atmosphere
Residual oxygen content < 5 ppm
Reproducibility of the soldering results
Traceability
Permanent process control
Ethernet interface
Remote maintenance (VPN)
Low energy and media consumption

Compare systems

Type	VADU 100	VADU 200XL	VADU 300XL	VADU 400XL
Type of system	Batch system	Batch or Inline system	Inline system	Inline system
Number of vacuum chambers	1 chamber with 2 separate process zones	2 chambers	3 chambers	4 chambers
Process area (W x D) [mm]	168 x 280	410 x 280	410 x 280	410 x 280
Clearance height [mm]	max. 50	max. 100	max. 100	max. 100
Vacuum (standard) [mbar]	≤ 2	≤ 2	≤ 2	≤ 2
Dimensions of the system (W x D x H) [mm]	1,070 x 1,130 x 1,150	1,758 x 1,911 x 2,381	2,436 x 1,911 x 2,381	3,114 x 1,911 x 2,381
Dimensions of pumping unit [mm]	Integrated	1,027 x 762 x 1,376	1,027 x 762 x 1,996	1,027 x 1,452 x 1,376
Weight [kg]	500	1,500 (without pumping unit)	2,000 (without pumping unit)	2,600 (without pumping unit)
Power supply	3 x 400 V, 50/60 Hz	3 x 400 V, 50/60 Hz	3 x 400 V, 50/60 Hz	3 x 400 V, 50/60 Hz
Power input [kVA]	5	19	27	35
SMEMA interface	–
Options
Handling / transfer systems
Soldering temperatures up to 500 °C
Induction heating		-	-	-
Integrated MES interfaces (e.g. SECS/GEM)